11/7、 アジア半導体機構（ASTSA)よりMAP2013開催のお知らせ
日 時：2013年11月7日(木) 10:20～18:00
会 場：タカクラホテル福岡（福岡市中央区渡辺通2-7-21）
MAP 2013 Program Overview
| Date: 7th November, 2013/ Venue: Takakura Hotel, Fukuoka | ||
|---|---|---|
| 10:20 ~ 10:30 | Opening Remark | Poster Exhibition |
| 10:30 ~ 12:30 | Session 1:Invited Talk | |
| 12:30 ~ 13:30 | Lunch Break | |
| 13:30 ~ 15:10 | Session 2:Packaging Supply Chain | |
| 15:10 ~ 15:30 | Break | |
| 15:30 ~ 17:10 | Session 3: 3D Integration Technology | |
| 17:10 ~ 17:30 | Break | |
| 17:30 ~ 18:20 | Session 4: Vietnam Session | |
| 18:30 ~ 20:00 | RSession 5: Poster Session (Reception Party) | |
MAP 2013 Program
| Thursday 7th, November | ||||||
10:20~10:30 |
Opening Remark
Hajime Tomokage |
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10:30~12:30 |
Session 1: Invited Talks
Chair: Kiyoshi Arita |
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| 10:30-11:10 |
1-1 Research & development of semiconductor devices for space applications Hiroyuki Shindo Japan Aerospace Exploration Agency (JAPAN) |
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| 11:10-11:50 |
1-2 3D packaging technology enabling next generation devices Mark Gerber Texas Instruments Incorporated (U.S.A.) |
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| 11:50-12:30 |
1-3 Embedded and stacking technology in ITRI (tentative) Wei-Chung Lo Industrial Technology Research Institute (TAIWAN) |
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| 12:30 ~ 13:30 | Lunch Break | |||||
13:30~15:10 |
Session 2: Packaging Supply Chain
Chair: Hisao Kasuga |
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| 13:30-13:50 |
2-1 LSI turnkey network business Hiroyuki Kataoka Hibikino System-Lab Inc. (JAPAN) |
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| 13:50-14:10 |
2-2 Cu balls and Cu-core balls for 3D packaging Hiroyoshi Kawasaki Senju Metal Indudtry Co., Ltd. (JAPAN) |
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| 14:10-14:30 |
2-3 Proposing “high current handling PCB”, an effective solution for heat countermeasure of semiconductor -introduction to advanced technology supporting emerging power semiconductors Manabu Mizuo TAIYO KOGYO CO., LTD. |
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| 14:30-14:50 |
2-4 SAMURAI CSP provider Jake Shibata Tera Probe, lnc. (JAPAN) |
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| 14:50-15:10 |
2-5 On achieving capture power safety in at-speed scan-based logic BIST Akihiro Tomita Kyushu Institute of Technology(JAPAN) |
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15:10~15:30 |
Break |
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15:30-17:10 |
Session 3: 3D Integration Technology
Chair: Hajime Tomokage |
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| 15:30-15:50 |
3-1 Updated status on embedding device technology in international standardization (IEC/TC91:electronics assembly) Hisao Kasuga International Standardization – Innovation Technology Research Association (INOTEK) (JAPAN) |
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| 15:50-16:10 |
3-2 The technology of CR-8000 for device embedded substrate Hirohiko Matsuzawa Zuken Inc. (JAPAN) |
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| 16:10-16:30 |
3-3 Parts mounting system for manufacturing PCBs with embedded components using FUJIKO Hiroyuki Ao Fuji Machine Mfg. Co., Ltd.(JAPAN) |
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| 16:30-16:50 |
3-4 T Through Silicon Via Process Using DRIE and Cathode PE-CVD Tomoyuki Nonaka SAMCO Inc. (JAPAN) |
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| 16:50-17:10 |
3-5 High thermal conductive inter chip fill for 3D-IC through pre-applied joining Yasuhiro Kawase Mitsubishi Chemical Corporation (JAPAN) |
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17:10~17:30 |
Break |
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17:30-18:20 |
Session 4: Vietnam Session
Chair: Daisuke Yoshimitsu |
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| 17:30-18:00 |
4-1 Introduction to the program “Development of integrated circuit industry of Ho Chi Minh City (tentative) Hoang Ngo Duc Vietnam National University Integrated Circuit Design Research and Education Center (Vietnam) |
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| 18:00-18:20 |
4-2 Collaboration between Vietnam national university with Kyushu institute of technology in terms of semiconductor fabrication and Wi-Fi chip design Hiroshi Ochi Kyushu Institute of Technology (JAPAN) |
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18:30~20:00 |
Poster session; Reception Party |
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| 5-1 | DENKEN Co., Ltd. | 5-2 | ALPHA DESIGN Co., Ltd. | |||
| 5-3 | Hibikino System-Lab Inc. | 5-4 | SAGA ELECTRONICS Co., Ltd. | |||
| 5-5 | FUKUDEN SHIZAI K.K. | 5-6 | Keirex Technology Inc. | |||
| 5-7 | YDC Corporation | 5-8 | Zuken Inc. | |||
| 5-9 | FUJI MACHINE MFG. Co., Ltd. | 5-10 | Noda Screen Co., Ltd. | |||
| 5-11 | WALTS Co., Ltd. | 5-12 | Hitachi Chemical Co., Ltd. | |||
| 5-13 | Senju Metal Industry Co., Ltd. | 5-14 | TAIYO KOGYO Corporation | |||
| 5-15 | SAMCO Inc. | 5-16 | PMT CORPORATION | |||
| 5-17 | Tera Probe, lnc. | 5-18 | OMRON Corporation | |||
| 5-19 | Kyushu Institute of Technology | 5-20 | Ellia Co., Ltd. | |||
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