The 14th International Workshop on Microelectronics Assembling and Packaging
MAP2014
The 14th International Workshop on Microelectronics Assembling and Packaging
Scope on MAP2014
The aim of the MAP workshop is to facilitate the creation of a value network by linking Kyushu,s over 700 IC affiliated companies with companies in Asia through open discussion and sharing of state-of-art ideas, techniques and perspectives on microelectronics assembling and packaging among leading industrial companies and academia. The workshop will consist of invited and contributed presentations, exhibition show, poster session, public and private business meetings. The official language is English.
In MAP2014, about 100 managers and engineers gathered to discuss Asia Semiconductor
Industry, three dimensional packaging, eco-devices.
Topics to be discussed are
■ Asia Semiconductor buisiness(India, Vietnam, China, Taiwan, Malaysia, Korea, Singapore, etc.)
■ Electronic components with built-in printed circuit board
■ Three-Demensional assembling(SiP)
■ Advanced Testing and Evaluation, analysis technologies
Date: 20 October, 2014
Venue: Denki-Building conference B
(2-1-82, Watanabe-dori, Chuo-ku, Fukuoka 810-0004, JAPAN)
MAP2014 Program Overview
|
Monday 20th, October |
|
|
10:30~10:35 |
Opening Remark |
|
10:35 ~ 12:10 |
Session 1: Invited Talk The 10th anniversary Memorial Session of Non-Profit Organization Semiconductor Technologies Marketing (STM) |
|
12:10 ~ 13:10 |
Lunch Break |
|
13:10 ~ 14:40 |
Session 2: Advanced Design and Test Technology |
|
14:40 ~ 15:10 |
Break |
|
15:10 ~ 16:50 |
Session 3: Device Embedding Technology |
|
16:50 ~ 17:10 |
Break |
|
17:10 ~ 17:50 |
Session 4: Semiconductor business in Southeast Asia |
|
18:00 ~ 19:15 |
Poster Session & Reception Party @BIZCOLI |
MAP2014 Program
Monday 20th, October
10:30~10:35 Opening Remark
Hajime Tomokage
Fukuoka University (JAPAN)
10:35~12:10 Session 1: Invited Talks
*The 10th anniversary Memorial Session of Non-Profit Organization
Semiconductor Technologies Marketing (STM)
Chair: Wei-Chung Lo
Industrial Technology Research Institute (TAIWAN)
10:35-11:30 1-1 Future of Semiconductor Industry
Yukio Sakamoto
Win Consultant (JAPAN)
11:30-12:10 1-2 Samsung’s Prosperity and Shadow “Retain the Sustainable Growth in the future?”
Masaaki Nomi
Former TOSHIBA Device Corporation (JAPAN)
| 12:10 ~ 13:10 Lunch Break |
13:10~14:40 Session 2: Advanced Design and Test Technology
Chair: Yoshihisa Katoh
Fukuoka University (JAPAN)
13:10-13:40 2-1 Nanotechnology in Electronics Packaging, Interconnect, & Assembly: Hype or Reality?
Charles E. Bauer
Tech Lead Corporation (U.S.A.)
13:40-14:00 2-2 New Test Equipment for Next Generation RF Application
Eiji Mori
SONIX Corporation (JAPAN)
14:00-14:20 2-3 Electrical Test Method for Printed Circuit Board with Embedded Components
Munehiro Yamashita
NIDEC-READ Corporation (JAPAN)
14:20-14:40 2-4 Through Silicon Via Process Using DRIE and Cathode PE-CVD
Fumiharu Matsuo
SAMCO Inc. (JAPAN)
| 14:30 ~ 15:10 Break |
15:10~16:50 Session 3: Device Embedding Technology
Chair: Hajime Tomokage
Fukuoka University (JAPAN)
15:10-15:30 3-1 Device Embedded Technology: Present and Future
Wei-Chung Lo
Industrial Technology Research Institute (Taiwan)
15:30-15:50 3-2 DES & International Standardization - JPCA perspective -
Kunio Takahara
Japan Electronics Packaging and Circuits Association (JAPAN)
15:50-16:10 3-3 SoC/SiP/PCB Co-Design solutions by CR-8000 Design Force
Kazunari Koga
Zuken Inc. (JAPAN)
16:10-16:30 3-4 Standardization of Electrical Test for Device Embedded Substrate
Hyunho Kim
Center for Integrated Smart Sensors (KOREA)
16:30-16:50 3-5 Cu-Cu Direct Bonding Technology for 2.5D/3D Integration
Taiji Sakai
Fujitsu Laboratories Ltd. (JAPAN)
| 16:50~17:10 Break |
17:10~17:50 Session 4: Semiconductor Business in Southeast Asia
Chair: Ema Hirata
Kyushu Economic Research Center (JAPAN)
17:10-17:30 4-1 The IC Industry of Vietnam – Present & Future –
Dang Luong Mo
Integrated Circuit Design and Education, Vietnam National Universty Ho Chi Minh(VIETNAM)
17:30-17:50 4-2 Trends of India Semiconductor Industry
Dorai Arasu
InfoSree Technologies Pvt., Ltd. (INDIA)
18:00~19:15 Poster Session & Reception Party
-
5-1 Hibikino System-Lab Inc. 5-2 FUKUDEN SHIZAI K.K. 5-3 Hitachi Maxell, Ltd. 5-4 Zuken Inc. 5-5 ELIA Co., Ltd. 5-6 Noda Screen Co., Ltd. 5-7 WALTS Co., Ltd. 5-8 SAMCO Inc. 5-9 Kamiens Technology Inc. 5-10 Industrial Technology Research Institute 5-11 Infosree Technologies Pvt., Ltd. 5-12 Sato-Shoji(Hong Kong Co., Ltd.) 5-13 NIDEC-READ Corporation 5-14 Frontier Semiconductor, Inc
Participation fee: Poster Exhibition 30,000JPY, Presentation 150,00JPY
If you join MAP2014, please contact us as bellows
Asia Semiconductor Trading Support Association(ASTSA)
Kyushu Economic Research Center (KERC)
Persons in Charge: E.Hirata
Address: 2-1-82, Watanabe-dori, Chuo-ku, Fukuoka 810-0004, JAPAN
Phone: +81-92-721-4907
Fax: +81-92-716-4710
e-mail: 
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